Nondestructive testing of bonded structures with Reverse Geometry X-ray imaging

Thomas Milton Albert

doi:10.1117/12.158603

27 September 1993 Nondestructive testing of bonded structures with Reverse Geometry X-ray imaging

Thomas Milton Albert

Proceedings Volume 1999, Adhesives Engineering; (1993) https://doi.org/10.1117/12.158603
Event: SPIE's 1993 International Symposium on Optics, Imaging, and Instrumentation, 1993, San Diego, CA, United States

Abstract

Die attach voids and bonding defects, including insufficient and excessive adhesive, as well as porosity (resin starvation) are imaged with Reverse Geometry X-ray^TM technology. HIgh contrast sensitivity (0.2%) is obtained in a large area, real-time/near real-time system. X-rays originate in the source, which is modelled upon the cathode ray tube. A computer synchronizes the beam sweep, the detector readout rate, and the monitor sweep. Digital output from the detector unit allows the system to display first generation images, without recourse to an image intensifier or vidicon. A small scintillating crystal detector is placed from 7 centimeters to 3 meters from the source/object.

Citation Download Citation

Thomas Milton Albert "Nondestructive testing of bonded structures with Reverse Geometry X-ray imaging", Proc. SPIE 1999, Adhesives Engineering, (27 September 1993); https://doi.org/10.1117/12.158603

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