Paper
27 September 1993 Mechanisms relating to reducing stress in curing thick sections of UV adhesives
Eric A. Norland, Frank S. Martin
Author Affiliations +
Abstract
Ultraviolet curing adhesives are widely used in optical lamination of precision optical lenses, safety windows, holographic displays, and flat panel displays. In most of these applications they are being used in relatively thin films from 3 microns to 40 mils, because most formulations will only allow uv light to penetrate to a certain depth. If the formulation does cure in thicker sections, the stress due to shrinkage typically becomes a problem. U.V. adhesives have been developed which can be cured in relatively thick sections with minimum stress. In this paper, a number of formulations are compared for variations in stress when cured in thick sections and the conditions and mechanism to minimize stress are characterized.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Eric A. Norland and Frank S. Martin "Mechanisms relating to reducing stress in curing thick sections of UV adhesives", Proc. SPIE 1999, Adhesives Engineering, (27 September 1993); https://doi.org/10.1117/12.158613
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KEYWORDS
Adhesives

Epoxies

Ultraviolet radiation

Flat panel displays

Precision optics

UV optics

Camera shutters

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