Chip to chip optical interconnects in a multichip module architecture

James A. Holmes

doi:10.1117/12.2298321

14 December 1992 Chip to chip optical interconnects in a multichip module architecture

James A. Holmes

Proceedings Volume 1929, 17th International Conference on Infrared and Millimeter Waves; 19295O (1992) https://doi.org/10.1117/12.2298321
Event: 17th International Conference on Infrared and Millimeter Waves, 1992, Pasadena, CA, United States

Abstract

This paper examines the chip to chip integration of optical interconnects (01). A multilevel planar architecture for chip to chip optical interconnection using a carrier wavelength of 0.94 pm and Si3N4 waveguides on an AN Multichip Module (MCM) substrate is proposed. The use of turning mirrors, microlenses and other optical elements to improve the loss budget are presented.

Citation Download Citation

James A. Holmes "Chip to chip optical interconnects in a multichip module architecture", Proc. SPIE 1929, 17th International Conference on Infrared and Millimeter Waves, 19295O (14 December 1992); https://doi.org/10.1117/12.2298321

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available