Paper
24 June 1993 High-performance packaging of gigabit data communication optical modules
Eric M. Foster, K. C. Jen, Carolyn A. Paddock, Jerry K. Radcliffe, William Vetter
Author Affiliations +
Proceedings Volume 1851, Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices; (1993) https://doi.org/10.1117/12.147601
Event: OE/LASE'93: Optics, Electro-Optics, and Laser Applications in Scienceand Engineering, 1993, Los Angeles, CA, United States
Abstract
Packaging technology is described for the DM-1062 gigabit optical module. This module is the IBM offering to comply with ANSI XT39.3 Fiber Channel Standard (FCS) for 1.0625 Gb/s optoelectronic transceiver with integrated serializer/deserializer functions. Performance data for this module is discussed as well as extensions of this technology to lower cost optical devices.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Eric M. Foster, K. C. Jen, Carolyn A. Paddock, Jerry K. Radcliffe, and William Vetter "High-performance packaging of gigabit data communication optical modules", Proc. SPIE 1851, Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices, (24 June 1993); https://doi.org/10.1117/12.147601
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Cited by 3 scholarly publications.
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KEYWORDS
Receivers

Eye

Silicon

Connectors

Modulation

Indium gallium arsenide

Packaging

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