Paper
27 October 1992 High-quality SiNx gate insulator for a-Si:H TFT LCD
Wen-Jian Lin, Hsiung-Ku Tsai, Biing-Seng Wu, Tung-Liang Lin, Yee-Min Lin, Hsiung-Kuang Chen
Author Affiliations +
Proceedings Volume 1815, Display Technologies; (1992) https://doi.org/10.1117/12.131311
Event: International Symposium on Optoelectronics in Computers, Communications, and Control, 1992, Hsinchu, Taiwan
Abstract
We have deposited silicon nitride (SiNx) films by plasma-enhanced chemical vapor deposition (PECVD) at 270 degree(s)C. Films are prepared by using silane (SiH4) and ammonia (NH3) source gases with hydrogen (H2) or nitrogen (N2) dilution. The film properties, including N/Si atomic ratio, hydrogen content, and the etching rate in 5% buffered HF are sensitive to the changes in dilution gases (H2 or N2) flow rate during deposition. For films with N/Si equals 1.33 (calculated by Rutherford backscattering, RBS); refractive index ((lambda) equals 6328 A) equals 2.0; hydrogen content equals 13% (calculated by Fourier transform infrared spectrometer, FTIR); and the etching rate in 5% buffered HF less than 50 A/min were achieved. In addition, the deposition rate of SiNx films were dropped dramatically by adding dilution gases, especially with H2 (from 4 A/sec to 1 A/sec). 3- inch 92,000 pixel elements a-Si:H TFT arrays with pre-mentioned high-quality SiNx films as gate insulators have been manufactured. The interlayer short defects of the a-Si:H TFT matrix arrays can be reduced to 3 points by adding dilution gas.
© (1992) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wen-Jian Lin, Hsiung-Ku Tsai, Biing-Seng Wu, Tung-Liang Lin, Yee-Min Lin, and Hsiung-Kuang Chen "High-quality SiNx gate insulator for a-Si:H TFT LCD", Proc. SPIE 1815, Display Technologies, (27 October 1992); https://doi.org/10.1117/12.131311
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KEYWORDS
Etching

Hydrogen

Silicon

Plasma enhanced chemical vapor deposition

Chemical species

FT-IR spectroscopy

Gases

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