Comparison of high heat flux cooling applications

Micheal J. Morgan; Won Soon Chang; Martin R. Pais; Louis C. Chow

doi:10.1117/12.140499

25 February 1993 Comparison of high heat flux cooling applications

Micheal J. Morgan, Won Soon Chang, Martin R. Pais, Louis C. Chow

Proceedings Volume 1739, High Heat Flux Engineering; (1993) https://doi.org/10.1117/12.140499
Event: San Diego '92, 1992, San Diego, CA, United States

Abstract

The advent of LSI/VLSI systems has made possible the development of advanced electronic systems operating in the multi-GHz regime. such high speed systems will be of multichip construction to increase miniaturization, packing, and heat dissipation density. Similar advances in high laser-power optics have resulted in significant increases in heat flux density. The stringent temperature uniformity specifications on these systems demand innovative means of applying state-of-the-art technology in enhancing heat removal. Promising cooling techniques that will meet the future thermal control requirements for these electronic and optics packages are presented. These concepts involve the use of microchannel, droplet impingement, jet impingement, and flow boiling in straight or curved channels.

Citation Download Citation

Micheal J. Morgan, Won Soon Chang, Martin R. Pais, and Louis C. Chow "Comparison of high heat flux cooling applications", Proc. SPIE 1739, High Heat Flux Engineering, (25 February 1993); https://doi.org/10.1117/12.140499

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