Novel chemical amplification positive-resist material for EB lithography

Naoko Kihara; Tohru Ushirogouchi; Tsukasa Tada; Takuya Naito; Satoshi Saito; Osamu Sasaki

doi:10.1117/12.59730

1 June 1992 Novel chemical amplification positive-resist material for EB lithography

Naoko Kihara, Tohru Ushirogouchi, Tsukasa Tada, Takuya Naito, Satoshi Saito, Osamu Sasaki

Proceedings Volume 1672, Advances in Resist Technology and Processing IX; (1992) https://doi.org/10.1117/12.59730
Event: Microlithography '92, 1992, San Jose, CA, United States

Abstract

This paper reports on a novel three-component chemical amplification positive resist system for EB lithography composed of a novolak resin, an acid generator, and a newly synthesized dissolution inhibitor. We synthesized a novel dissolution inhibitor named CP-TBOC (1), which contains a tert-butoxycarbonyl (t-BOC) group and a lactone ring, to obtain resist materials with high sensitivity and high contrast. The t-BOC group of this dissolution inhibitor effectively decomposed by an acid catalyzed thermal reaction as the other conventional dissolution inhibitors. In addition to this decomposition, the lactone ring of the decomposed product was spontaneously cleft in an aqueous base to generate carboxylic acid, further enhancing the solubility to alkaline developers. The subsequent cleavage in an aqueous developer was investigated by UV-visible spectroscopy. The highest EB sensitivity was obtained at a CP-TBOC concentration of approximately 4.7 X 10-4 mol/g.

Citation Download Citation

Naoko Kihara, Tohru Ushirogouchi, Tsukasa Tada, Takuya Naito, Satoshi Saito, and Osamu Sasaki "Novel chemical amplification positive-resist material for EB lithography", Proc. SPIE 1672, Advances in Resist Technology and Processing IX, (1 June 1992); https://doi.org/10.1117/12.59730

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