Novel surface imaging process with ion-beam lithography and dry development

Ulrich A. Jagdhold; Wolfgang Pilz; L. M. Buchmann; M. Torkler

doi:10.1117/12.136035

9 July 1992 Novel surface imaging process with ion-beam lithography and dry development

Ulrich A. Jagdhold, Wolfgang Pilz, L. M. Buchmann, M. Torkler

Proceedings Volume 1671, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing II; (1992) https://doi.org/10.1117/12.136035
Event: Microlithography '92, 1992, San Jose, CA, United States

Abstract

A new resist processing is presented using the carbonization of organic polymer-based resists due to ion beam exposure and a following dry development under O2-RIE conditions. As an example for this process, a negative tone pattern transfer yielding a structure size down to 50 nm is demonstrated. The influence of the ion exposure dose and the O2-RIE conditions on the pattern transfer are discussed in this paper.

Citation Download Citation

Ulrich A. Jagdhold, Wolfgang Pilz, L. M. Buchmann, and M. Torkler "Novel surface imaging process with ion-beam lithography and dry development", Proc. SPIE 1671, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing II, (9 July 1992); https://doi.org/10.1117/12.136035

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