Thermal strain measurements of solder joints in electronic packaging using moire interferometry

Charls G. Woychik; Yifan Guo

doi:10.1117/12.57472

1 December 1991 Thermal strain measurements of solder joints in electronic packaging using moiré interferometry

Charls G. Woychik, Yifan Guo

Proceedings Volume 1554, Second International Conference on Photomechanics and Speckle Metrology; (1991) https://doi.org/10.1117/12.57472
Event: San Diego, '91, 1991, San Diego, CA, United States

Abstract

Thermal strains are the major cause of low cycle fatigue failures of solder interconnections in an electronic package. The strains are created by a coefficient of thermal expansion (CTE) mismatch that occurs between two levels of packaging. As the package approaches smaller dimensions, the measurements of strain concentrations in the solder interconnection become very difficult. In this paper, Moiré interferometry technique was applied to evaluate the thermal strains in the second level interconnections for both conventional pin-in-hole (PIH) packages and surface mount components. The coefficient of thermal expansion of each component was measured. The thermal strains distributions in the solder interconnections (typical dimensions are 10 - 100 micrometers) were determined, and the reliability issues were discussed. The strains in solder joints of the PIH components were much higher than those of the stacked surface mount component. Even though the surface mount component had a lower inherent strength, the overall mechanical reliability was much higher since there were practically no localized strain concentrations.

Citation Download Citation

Charls G. Woychik and Yifan Guo "Thermal strain measurements of solder joints in electronic packaging using moiré interferometry", Proc. SPIE 1554, Second International Conference on Photomechanics and Speckle Metrology, (1 December 1991); https://doi.org/10.1117/12.57472

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