Polysilanes for microlithography

Gregory M. Wallraff; Robert D. Miller; Nicholas J. Clecak; M. Baier

doi:10.1117/12.46372

1 June 1991 Polysilanes for microlithography

Gregory M. Wallraff, Robert D. Miller, Nicholas J. Clecak, M. Baier

Proceedings Volume 1466, Advances in Resist Technology and Processing VIII; (1991) https://doi.org/10.1117/12.46372
Event: Microlithography, 1991, San Jose, CA, United States

Abstract

We have recently reported the formation of scum-free micron images in a bilayer composed of a thin (1500 angstrom) imaging layer of poly(cyclohexylmethylsilane) coated over a thick planarizing layer of a hardbaked diazoquinone-novalac type photoresist using deep UV exposure. Although excellent resolution was achieved (< 0.5 micrometers ) in this process, the exposure doses required (125-150 mJ/cm2) were higher than desirable for commercial DUV imaging tools. We have addressed this problem using two approaches: (i) the synthesis of new polysilanes which are intrinsically more sensitive to photodegradation in the solid state and (ii) the incorporation of additives which enhance the photosensitivity. Regarding the former, a number of aryl substituted polysilane homopolymers which are significantly more photolabile than the standard poly (methylphenylsilane), as assayed by the rate of spectral photobleaching upon exposure to DUV radiation, have been prepared and tested. In addition, a number of small molecule additives which quantitatively quench the polymer fluorescence in the solid state have been identified. Some of the additives which efficiently quench the polymer fluorescence in the solid state also accelerate the rate of photodegradation. The combination of the new polysilane materials with sensitizing additives has allowed submicron DUV imaging at exposure doses as low as 20 mJ/cm2 or less in a bilayer configuration employing O2-RIE for image transfer of the wet-developed images.

Citation Download Citation

Gregory M. Wallraff, Robert D. Miller, Nicholas J. Clecak, and M. Baier "Polysilanes for microlithography", Proc. SPIE 1466, Advances in Resist Technology and Processing VIII, (1 June 1991); https://doi.org/10.1117/12.46372

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available