Paper
1 July 1991 Semiconductor thin-film optical constant determination and thin-film thickness measurement equipment correlation
Anne M. Kaiser
Author Affiliations +
Abstract
There are several methods for correlating thin film thickness measurement equipment. The most commonly used method is to program in an offset that gets systematically added to or subtracted from the thickness calculation. Measurement errors can occur using this 'fudge factor' method because the relationship between the reference thicknesses and the measured thicknesses is not, in general, a fixed constant or simple function. A better method for correlating thin film thickness measurement equipment is to tune the instruments to the process by refining the internal optical constants.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Anne M. Kaiser "Semiconductor thin-film optical constant determination and thin-film thickness measurement equipment correlation", Proc. SPIE 1464, Integrated Circuit Metrology, Inspection, and Process Control V, (1 July 1991); https://doi.org/10.1117/12.44451
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KEYWORDS
Refractive index

Thin films

Refraction

Oxides

Polarization

Semiconducting wafers

Inspection

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