Paper
1 March 1991 Effects of environmental and installation-specific factors on process gas delivery via mass-flow controller with an emphasis on real-time behavior
David E. Gray, Neil M. P. Benjamin, Brian N. Chapman
Author Affiliations +
Proceedings Volume 1392, Advanced Techniques for Integrated Circuit Processing; (1991) https://doi.org/10.1117/12.48933
Event: Processing Integration, 1990, Santa Clara, CA, United States
Abstract
The use of the thermal transport mass flow controller (MFC) is currently the method of choice for gas delivery in semiconductor processes. Many environmental and installation factors influence the operational behavior of these MFCs and may cause a significant deviation from their specified performance. The impact of several of these factors will be discussed. Some of the issues to be addressed include environmental temperature upstream pressure and regulation mixing manifolds and tubulation (gas system geometry). Flow parameters tested include average flow rate vs setpoint flow control time and maximum flow rate (switch-on transients). In addition qualitative observations concerning real time flow behavior will be made. Measurement techniques and other issues affecting gas delivery will also be discussed.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David E. Gray, Neil M. P. Benjamin, and Brian N. Chapman "Effects of environmental and installation-specific factors on process gas delivery via mass-flow controller with an emphasis on real-time behavior", Proc. SPIE 1392, Advanced Techniques for Integrated Circuit Processing, (1 March 1991); https://doi.org/10.1117/12.48933
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KEYWORDS
Microsoft Foundation Class Library

Integrated circuits

Sensors

Temperature metrology

Calibration

Thermal effects

Manufacturing

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