Harnessing exciton-strain interactions in 2D TMDCs for advanced sensing and photodetection

Chandraman Patil; Isaac Yu; Peter Van Kirk; Elham Heidari; Hamed Dalir

doi:10.1117/12.3027818

30 September 2024 Harnessing exciton-strain interactions in 2D TMDCs for advanced sensing and photodetection

Chandraman Patil, Isaac Yu, Peter Van Kirk, Elham Heidari, Hamed Dalir

Proceedings Volume 13140, Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications XVIII; 1314004 (2024) https://doi.org/10.1117/12.3027818
Event: Optical Engineering + Applications, 2024, San Diego, California, United States

Abstract

This work presents the fabrication and experimental demonstration of heterogeneously integrated photodetectors using monolayer WS₂, aimed at advancing ultra-thin optoelectronic devices. By employing silicon nitride wafers with SiN/SiO₂ layers, precise device patterning was achieved through electron beam lithography and dry etching, followed by the integration of WS₂ flakes using a wet etching technique. The study focused on the device's broadband transmission properties, observing a significant shift in the exciton absorption wavelength (~10 nm) due to strain introduced during the integration process. This shift highlights the potential for manipulating optical properties through strain engineering. The devices exhibited high spectral responsivities at the WS₂ exciton wavelength, demonstrating their efficacy in the visible spectrum. These findings pave the way for future on-chip photonic devices operating at visible wavelengths, with promising applications in strainoptronics and other advanced optoelectronic systems.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Chandraman Patil, Isaac Yu, Peter Van Kirk, Elham Heidari, and Hamed Dalir "Harnessing exciton-strain interactions in 2D TMDCs for advanced sensing and photodetection", Proc. SPIE 13140, Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications XVIII, 1314004 (30 September 2024); https://doi.org/10.1117/12.3027818

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