Effect of liquid solder on shear strength of solder/Cu porous joint

Wenpeng Jiang; Siliang He; Bifu Xiong; Jiale Yang; Chan Guo

doi:10.1117/12.3026238

1 April 2024 Effect of liquid solder on shear strength of solder/Cu porous joint

Wenpeng Jiang, Siliang He, Bifu Xiong, Jiale Yang, Chan Guo

Proceedings Volume 13082, Fourth International Conference on Mechanical Engineering, Intelligent Manufacturing, and Automation Technology (MEMAT 2023); 130822F (2024) https://doi.org/10.1117/12.3026238
Event: 2023 4th International Conference on Mechanical Engineering, Intelligent Manufacturing and Automation Technology (MEMAT 2023), 2023, Guilin, China

Abstract

Power semiconductor devices have seen a rise in the development of wide bandgap (WBG) semiconductors. WBG devices can be bonded at low temperatures due to the transient liquid phase (TLP) bonding process. Applying Cu porous in TLP has been the subject of relevant studies. The strength of metallic joints created by various solders with Cu porous, however, has received less attention in earlier investigations. In this study, the shear strength of metallic joints made of SAC and Sn58Bi is examined. Cu porous was used as an intermediate metal layer, and a 0.2 mm layer of Sn58Bi / SAC solder paste was applied to its top and bottom surfaces. Research has also looked into the impact of bonding time. It can be inferred that the metal junctions formed with SAC solder are stronger and better suited for transient liquid bonding.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Wenpeng Jiang, Siliang He, Bifu Xiong, Jiale Yang, and Chan Guo "Effect of liquid solder on shear strength of solder/Cu porous joint", Proc. SPIE 13082, Fourth International Conference on Mechanical Engineering, Intelligent Manufacturing, and Automation Technology (MEMAT 2023), 130822F (1 April 2024); https://doi.org/10.1117/12.3026238

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