Exploiting spatial characteristic of wafer for effective OCW: area partitioning OCW

Gilwoo Song; Dooho Kang; Sungchai Kim; Sungwon Park; Taeyong Jo; Euiseok Kum; Jonghyun Lee; Dooho Park; Dongmin Kim; Sungwoon Uh; Jaehyung Kim

doi:10.1117/12.2670089

27 April 2023 Exploiting spatial characteristic of wafer for effective OCW: area partitioning OCW

Gilwoo Song, Dooho Kang, Sungchai Kim, Sungwon Park, Taeyong Jo, Euiseok Kum, Jonghyun Lee, Dooho Park, Dongmin Kim, Sungwoon Uh, Jaehyung Kim

Author Affiliations +

Proceedings Volume 12496, Metrology, Inspection, and Process Control XXXVII; 124963N (2023) https://doi.org/10.1117/12.2670089
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Conference Poster

Abstract

Optimal color weighting (OCW) is a promising technique to improve accuracy and robustness of alignment mark measurement in the lithography process. Measurement based OCW shows remarkable improvement of overlay error under laboratory conditions. In those conditions, one of the wafer processes is split and a simple form of mark deformation is present. However, the OCW effect has not been confirmed in the case of on-product overlay since various of deformations are mixed in the real FAB. We perform simple simulation showing that mixed deformations can deteriorate the performance of OCW and show that utilizing spatial characteristics of the wafer with OCW further improves the overlay error. As a result, we have improved on-product-overlay form 3.78 nm to 3.51 nm or 7.1% using data of 86 lots, 268 wafers in DUV layer of 3 nm logic device.

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Gilwoo Song, Dooho Kang, Sungchai Kim, Sungwon Park, Taeyong Jo, Euiseok Kum, Jonghyun Lee, Dooho Park, Dongmin Kim, Sungwoon Uh, and Jaehyung Kim "Exploiting spatial characteristic of wafer for effective OCW: area partitioning OCW", Proc. SPIE 12496, Metrology, Inspection, and Process Control XXXVII, 124963N (27 April 2023); https://doi.org/10.1117/12.2670089

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