Novel depth quantification technique of buried defect for development of non-destructive optical inspection

Min Ho Rim; Jongsok Yi; Jungtaek Lim; Souk Kim; Younghoon Sohn

doi:10.1117/12.2656994

27 April 2023 Novel depth quantification technique of buried defect for development of non-destructive optical inspection

Min Ho Rim, Jongsok Yi, Jungtaek Lim, Souk Kim, Younghoon Sohn

Author Affiliations +

Proceedings Volume 12496, Metrology, Inspection, and Process Control XXXVII; 124961R (2023) https://doi.org/10.1117/12.2656994
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

As design rule of device shrinks quickly, process controls of HAR (high aspect ratio) buried defect become very crucial. In the past, monitoring of this defect mostly depended on e-beam inspection and destructive inspection. These methods cost a lot and need more time to prepare. So, optical inspection has been requested continuously. However, there are several technical obstacles, such as severe noises from under layers and quantification of defect height. In this study, we developed novel depth quantification technique for HAR structure. By using this new technique, we drastically improved (x240% higher) sensitivity of not-open defect. Light budget was rigorously analyzed and optimized for best SNR. To design deliberate non-destructive height quantification technique, we are currently working on development of TSOM (Through-focus Scanning Optical Microscopy) technique for HAR defect.

Conference Presentation

Citation Download Citation

Min Ho Rim, Jongsok Yi, Jungtaek Lim, Souk Kim, and Younghoon Sohn "Novel depth quantification technique of buried defect for development of non-destructive optical inspection", Proc. SPIE 12496, Metrology, Inspection, and Process Control XXXVII, 124961R (27 April 2023); https://doi.org/10.1117/12.2656994

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