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We demonstrate a silicon-nitride Photonic Integrated Circuit based RGB light engine. The engine uses a flip chip laser diode assembly process for hybrid integration of the Red, Green and Blue laser diodes, as well as power monitoring detectors. The lasers are flip chip soldered in etched recesses in the silicon nitride PIC for optimal coupling. Small formfactor 5x10x1 mm3 (width x length x thickness) devices have been realized. Output powers of ~1mW are measured and depend on the laser diodes used. Typical coupling losses are 1.5 dB for the actively aligned implementations. The described assembly approach facilitates wafer level laser diode integration and wafer level hermetic packaging for scalable volume manufacturing.
Raimond N. Frentrop,Douwe H. Geuzebroek,Edwin J. Klein,Floris H. Falke, andRonald Dekker
"Hybrid integrated RGB light engine for AR in silicon nitride PIC technology", Proc. SPIE 12449, Optical Architectures for Displays and Sensing in Augmented, Virtual, and Mixed Reality (AR, VR, MR) IV, 124490F (16 March 2023); https://doi.org/10.1117/12.2649937
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Raimond N. Frentrop, Douwe H. Geuzebroek, Edwin J. Klein, Floris H. Falke, Ronald Dekker, "Hybrid integrated RGB light engine for AR in silicon nitride PIC technology," Proc. SPIE 12449, Optical Architectures for Displays and Sensing in Augmented, Virtual, and Mixed Reality (AR, VR, MR) IV, 124490F (16 March 2023); https://doi.org/10.1117/12.2649937