A DIC-based method for measuring the thermal expansion coefficient of porous flexible foam material board

Lixia Liu; Xiaojun Tang; Qifan Yang; Hongtao Ren; Tianli Hui

doi:10.1117/12.2654909

28 September 2022 A DIC-based method for measuring the thermal expansion coefficient of porous flexible foam material board

Lixia Liu, Xiaojun Tang, Qifan Yang, Hongtao Ren, Tianli Hui

Author Affiliations +

Proceedings Volume 12339, Second International Conference on Cloud Computing and Mechatronic Engineering (I3CME 2022); 123390U (2022) https://doi.org/10.1117/12.2654909
Event: Second International Conference on Cloud Computing and Mechatronic Engineering (I3CME 2022), 2022, Chendu, China

Abstract

Porous flexible foam material board, represented by polyimide, has the characteristics of lightweight, vibration damping, and heat insulation, which is widely used in the cushioning and heat insulation structure of super-static, super-stable, and super-precision satellites. As the thermal insulation and buffer layer of satellite, the coefficient of thermal expansion is the key performance parameter and the important index of satellite structure design under the space environment with large temperature variation. However, the existing thermal expansion coefficient measurement technology has some problems, such as contact force interference, low measurement accuracy, complex measurement process. To solve the above measurement problems, this paper designs a thermal expansion coefficient measurement method of porous flexible materials based on digital image correlation (DIC) measurement technology. This method uses the temperature loading system with adjustable size to control the temperature of the measured object, and combines multi-target processing method and DIC technology to realize the thermal expansion coefficient measurement of porous flexible materials. Through the uncertainty evaluation and verification experiment of the method, it is shown that the method is accurate and reliable.

Citation Download Citation

Lixia Liu, Xiaojun Tang, Qifan Yang, Hongtao Ren, and Tianli Hui "A DIC-based method for measuring the thermal expansion coefficient of porous flexible foam material board", Proc. SPIE 12339, Second International Conference on Cloud Computing and Mechatronic Engineering (I3CME 2022), 123390U (28 September 2022); https://doi.org/10.1117/12.2654909

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KEYWORDS

Temperature metrology

Foam

Digital image correlation

Speckle

CCD cameras

Satellites

Control systems

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