Mechanical modeling and compression test of sesame seed based on 3D laser scanning technology

Jing Zhao; Tianlu Wei; Qianqian Cheng

doi:10.1117/12.2638928

20 September 2022 Mechanical modeling and compression test of sesame seed based on 3D laser scanning technology

Jing Zhao, Tianlu Wei, Qianqian Cheng

Proceedings Volume 12261, International Conference on Mechanical Design and Simulation (MDS 2022); 1226138 (2022) https://doi.org/10.1117/12.2638928
Event: Second International Conference on Mechanical Design and Simulation (MDS 2022), 2022, Wuhan, China

Abstract

To study the mechanical damage of sesame seeds in planting, harvesting and threshing, the static compression test and finite element simulation were carried out on Zhengzhi HL05 sesame seeds. Based on the experimental results, given the same moisture content, sesame seeds have the largest crushing load under flat compression, the second largest crushing load under lateral compression and the smallest load under vertical compression; when the loading direction is the same, the elastic modulus, maximum deformation and crushing load decrease with the increase of moisture content; the elastic modulus of sesame seeds is within the range of 1.64MPa-7.06MPa, the maximum deformation ranges from 0.23mm to 1.05mm, and the crushing load varies from 1.84N to 12.9N. Mechanical modeling and finite element simulation of sesame seeds based on 3D laser scanning technology explains the crushing mechanism of sesame seeds more intuitively, with the maximum error between the simulation and the experiment being less than 7%, which verifies the feasibility and accuracy of modeling based on 3D laser scanning technology, and provides a new method for modeling small-sized and irregular-shaped agricultural products.

Citation Download Citation

Jing Zhao, Tianlu Wei, and Qianqian Cheng "Mechanical modeling and compression test of sesame seed based on 3D laser scanning technology", Proc. SPIE 12261, International Conference on Mechanical Design and Simulation (MDS 2022), 1226138 (20 September 2022); https://doi.org/10.1117/12.2638928

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