Evaluation of temperature measurement using 80 × 32 silicon-on-insulator diode uncooled infrared focal plane array

Misaki Hanaoka; Yasuhiro Kosasayama; Hisatoshi Hata; Kenji Shintani; Masashi Kamiya; Daisuke Fujisawa; Mikio Yamamuka; Shotaro Miwa

doi:10.1117/12.2618715

27 May 2022 Evaluation of temperature measurement using 80 × 32 silicon-on-insulator diode uncooled infrared focal plane array

Misaki Hanaoka, Yasuhiro Kosasayama, Hisatoshi Hata, Kenji Shintani, Masashi Kamiya, Daisuke Fujisawa, Mikio Yamamuka, Shotaro Miwa

Author Affiliations +

Proceedings Volume 12107, Infrared Technology and Applications XLVIII; 121071A (2022) https://doi.org/10.1117/12.2618715
Event: SPIE Defense + Commercial Sensing, 2022, Orlando, Florida, United States

Abstract

We evaluated the possibility of performing temperature measurements using an uncooled infrared focal plane array (IRFPA), consisting of an 8032 array of p-n junction diodes fabricated on a silicon-on-insulator (SOI) substrate (MIR8032B1). We previously reported the sensor design and data collection method for the MIR8032B1 at SPIE in 2021. In this presentation, we describe an aberration correction method and a comparison of different lenses with a high modulation transfer function. We verified the accuracy of the measurements using a shutterless method based on the thermal characteristics of the SOI diodes. Based on the results obtained in the present study, we discuss the applicability of such IRFPAs for temperature measurements.

Conference Presentation

Citation Download Citation

Misaki Hanaoka, Yasuhiro Kosasayama, Hisatoshi Hata, Kenji Shintani, Masashi Kamiya, Daisuke Fujisawa, Mikio Yamamuka, and Shotaro Miwa "Evaluation of temperature measurement using 80 × 32 silicon-on-insulator diode uncooled infrared focal plane array", Proc. SPIE 12107, Infrared Technology and Applications XLVIII, 121071A (27 May 2022); https://doi.org/10.1117/12.2618715

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