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Author(s), “Title of Paper,” in DTCO and Computational Patterning, edited by Ryoung-Han Kim, Neal V. Lafferty, Proc. of SPIE 12052, Seven-digit Article CID Number (DD/MM/YYYY); (DOI URL).
ISSN: 0277-786X
ISSN: 1996-756X (electronic)
ISBN: 9781510649798
ISBN: 9781510649804 (electronic)
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Conference Committee
Symposium Chairs
Kafai Lai, University of Hong Kong (United States)
Symposium Co-Chair
Qinghuang Lin, LAM Research Corporation (United States)
Conference Chair
Ryoung-Han Kim, IMEC (Belgium)
Conference Co-Chair
Neal V. Lafferty, Mentor, a Siemens Business (United States)
Conference Program Committee
Jason P. Cain, Advanced Micro Devices, Inc. (United States)
Lifu Chang, MOSIS Integrated Circuit Fabrication Service (United States)
Dan J. Dechene, IBM Thomas J. Watson Research Center (United States)
Yuri Granik, Siemens Industry Software Inc. (United States)
Harsha Grunes, Intel Corporation (United States)
Srividya Jayaram, Mentor, a Siemens Business (United States)
Sungwoo Ko, SK Hynix, Inc. (Korea, Republic of)
Sachiko Kobayashi, KIOXIA Corporation (Japan)
Kafai Lai, The University of Hong Kong (United States)
Ya-Chieh Lai, Cadence Design Systems, Inc. (United States)
Lars W. Liebmann, TEL Technology Ctr., America, LLC (United States)
Kevin Lucas, Synopsys, Inc. (United States)
Larry Melvin, Intel Corporation (United States)
Shigeki Nojima, KIOXIA Corporation (Japan)
David Z. Pan, The University of Texas at Austin (United States)
Piyush Pathak, Cadence Design Systems, Inc. (United States)
Michael L. Rieger, Consultant (United States)
Vivek K. Singh, Intel Corporation (United States)
Kunal N. Taravade, Synopsys, Inc. (United States)
Chun-Ming Wang, Western Digital Corporation (United States)
Lynn T. Wang, GLOBALFOUNDRIES Inc. (United States)
Yayi Wei, Institute of Microelectronics, Chinese Academy of Sciences (United States)
Chi-Min Yuan, NXP Semiconductors (United States)