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Phase Change Memory (PCM) materials can be damaged during plasma exposure leading to changes in phase transition behavior. Etch-induced damage and crystallization properties of GeSbTe (GST) were evaluated as a function of substrate temperature, plasma chemistry, and plasma exposure time. Enhanced damage formation is related to selective elemental depletion and non-volatilized etch residue retention in the near surface region. These experiments validate literature findings that crystallization time increases with reduction in film thickness for GST samples capped with a thin SiO2 film, indicating the presence of a modified layer which serves as an interface layer material. A direct comparison of passivating properties of hydrofluorocarbon and hydrocarbon on GST can be more conclusive with a fine tuning of film thickness and an evaluation of total residue retention with depth profiling.
L. Buzi,J. M. Papalia,H. Miyazoe,H.-Y. Cheng,M. Hopstaken,R. L. Bruce, andS. U. Engelmann
"Effect of surface temperature on GeSbTe damage formation during plasma processing", Proc. SPIE 11615, Advanced Etch Technology and Process Integration for Nanopatterning X, 116150G (1 March 2021); https://doi.org/10.1117/12.2581706
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L. Buzi, J. M. Papalia, H. Miyazoe, H.-Y. Cheng, M. Hopstaken, R. L. Bruce, S. U. Engelmann, "Effect of surface temperature on GeSbTe damage formation during plasma processing," Proc. SPIE 11615, Advanced Etch Technology and Process Integration for Nanopatterning X, 116150G (1 March 2021); https://doi.org/10.1117/12.2581706