Addressing metallic contaminants in the photochemical supply chain

Jad A. Jaber; James Hamzik; Nicholas Filipancic; Justin Brewster; Annie Xia

doi:10.1117/12.2551646

23 March 2020 Addressing metallic contaminants in the photochemical supply chain

Jad A. Jaber, James Hamzik, Nicholas Filipancic, Justin Brewster, Annie Xia

Proceedings Volume 11326, Advances in Patterning Materials and Processes XXXVII; 1132613 (2020) https://doi.org/10.1117/12.2551646
Event: SPIE Advanced Lithography, 2020, San Jose, California, United States

Abstract

Metal contaminants are notorious yield detractors throughout semiconductor unit processes. Metallic contaminants can create small, hard-to-detect defects that can eventually result in cone defects and gate leakage. Because these contaminants are so hard to detect, it is extremely difficult to pinpoint their root cause and identify opportunities to remove them. Clean photochemicals experience many contamination opportunities between their final quality control checks at the end of manufacturing and dispense onto a wafer. The complexity of the interactions of metal contaminants and the components in photochemicals is an important consideration when designing removal methods. This challenge increases when metaloxide photoresists are introduced into high volume manufacturing, whereby metals that enhance etch resistance must remain in the formulation, while specific metal contaminants must be removed. In this paper, we will describe different types of metal contaminants in photochemicals and raw materials, review how these contaminants are removed using membrane-based technologies, and define new methodologies to better target metal in photochemicals.

Conference Presentation

Citation Download Citation

Jad A. Jaber, James Hamzik, Nicholas Filipancic, Justin Brewster, and Annie Xia "Addressing metallic contaminants in the photochemical supply chain", Proc. SPIE 11326, Advances in Patterning Materials and Processes XXXVII, 1132613 (23 March 2020); https://doi.org/10.1117/12.2551646

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