Presentation + Paper
28 February 2020 Injection molded low-thermal-expansion multi-fiber ferrule
Author Affiliations +
Proceedings Volume 11286, Optical Interconnects XX; 112860T (2020) https://doi.org/10.1117/12.2545040
Event: SPIE OPTO, 2020, San Francisco, California, United States
Abstract
Hybrid injection-molded ferrules are presented which consist of a polymer body and an over-molded glass insert. The average coefficient of thermal expansion observed at the front face of the ferrules is 8 ppm/C from room temperature to 100 C. This design could be applicable for direct heterogeneous re-matable connections between fiber ribbons and photonic integrated circuits which exhibit low thermal expansion and operate at elevated temperatures.
Conference Presentation
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ulrich W. Neukirch, Woraphat Dockchoorung, Stephen Q. Smith, Robert A. Bellman, Esteban Marin, Darrell Childers, and DJ Hastings "Injection molded low-thermal-expansion multi-fiber ferrule", Proc. SPIE 11286, Optical Interconnects XX, 112860T (28 February 2020); https://doi.org/10.1117/12.2545040
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KEYWORDS
Glasses

Polymers

Interfaces

Temperature metrology

Waveguides

Data modeling

Polishing

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