High throughput LIFT printing of electric circuitry

Sharona Sedghani Cohen; Oleg Ermak; Itay Peled; Zvi Kotler

doi:10.1117/12.2544751

2 March 2020 High throughput LIFT printing of electric circuitry

Sharona Sedghani Cohen, Oleg Ermak, Itay Peled, Zvi Kotler

Proceedings Volume 11271, Laser 3D Manufacturing VII; 112710C (2020) https://doi.org/10.1117/12.2544751
Event: SPIE LASE, 2020, San Francisco, California, United States

Abstract

Laser Induced Forward Transfer (LIFT) is a digital, non-contact printing technology of solid metals as well as viscous inks and pastes. It is highly promising for various printed electronics applications, also when high-resolution is required given its versatility in printable materials, controlled droplet volume down to <100 fL and accurate positioning down to <~5μm. Moreover, since typically no post-processing is required, deposition on a wide range of sensitive substrates is made possible. We will demonstrate high speed and high-resolution LIFT printing of electrical circuitry relying on fast material supply in the form of metal coated foil and fast, random access, laser beam steering. Examples of printed porous material structures will be shown as a demonstration to the capacity to design and fabricate materials with specific thermal, electrical and mechanical properties.

Citation Download Citation

Sharona Sedghani Cohen, Oleg Ermak, Itay Peled, and Zvi Kotler "High throughput LIFT printing of electric circuitry", Proc. SPIE 11271, Laser 3D Manufacturing VII, 112710C (2 March 2020); https://doi.org/10.1117/12.2544751

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