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9 March 2020 Ultrafast stamping by combination of synchronized galvanometer scanning with DOE's or SLM (Conference Presentation)
Beat Neuenschwander, Markus Gafner, Stefan M. Remund, Michalina W. Chaja
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Proceedings Volume 11267, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV; 112670Q (2020) https://doi.org/10.1117/12.2550088
Event: SPIE LASE, 2020, San Francisco, California, United States
Abstract
The upscaling of laser micromachining processes with ultrashort pulses is limited due to heat accumulation and shielding effects. Multibeam scanning represents one of the strategies to overcome this drawback. It is in general realized by combining a diffractive beam splitter with a galvanometer scanner. A full synchronization with the laser repetition rate offers new possibilities with minimum thermal impact. We will demonstrate this by means of a multipulse-drilling on the fly process with a regular 5x5 spot pattern having a spot to spot spacing of 160µm. With a constant speed (synchronized to the laser) this pattern can be moved by exactly this spacing between two laser pulses. At a repetition rate of 100 kHz and an average power of 16 W we were able to drill more than 1'500 holes/s in a 10µm thick steel foil without any thermal impact. In a next step we will extend this technology with an SLM to different periodic patterns.
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Beat Neuenschwander, Markus Gafner, Stefan M. Remund, and Michalina W. Chaja "Ultrafast stamping by combination of synchronized galvanometer scanning with DOE's or SLM (Conference Presentation)", Proc. SPIE 11267, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXV, 112670Q (9 March 2020); https://doi.org/10.1117/12.2550088
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KEYWORDS
Diffractive optical elements
Ultrafast phenomena
Spatial light modulators
3D scanning
Laser scanners
Beam splitters
Laser processing
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