Open Access Paper
14 June 2019 Front Matter: 10963
Abstract
This PDF file contains the front matter associated with SPIE Proceedings Volume 10963 including the Title Page, Copyright information, Table of Contents, Introduction, and Conference Committee listing.

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Author(s), “Title of Paper,” in Advanced Etch Technology for Nanopatterning VIII, edited by Richard S. Wise, Catherine B. Labelle, Proceedings of SPIE Vol. 10963 (SPIE, Bellingham, WA, 2019) Seven-digit Article CID Number.

ISSN: 0277-786X

ISSN: 1996-756X (electronic)

ISBN: 9781510625730

ISBN: 9781510625747 (electronic)

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  • The last two digits indicate publication order within the volume using a Base 36 numbering system employing both numerals and letters. These two-number sets start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B … 0Z, followed by 10-1Z, 20-2Z, etc. The CID Number appears on each page of the manuscript.

Authors

Numbers in the index correspond to the last two digits of the seven-digit citation identifier (CID) article numbering system used in Proceedings of SPIE. The first five digits reflect the volume number. Base 36 numbering is employed for the last two digits and indicates the order of articles within the volume. Numbers start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B…0Z, followed by 10-1Z, 20-2Z, etc.

Alian, A., 05

Altamirano Sánchez, Efrain, 0P

Baderot, J., 0C

Ban, Yang, 09, 0T

Bernard, G., 0C

Biolsi, Peter, 0E

Bonnecaze, Roger T., 09, 0T

Capogreco, E., 05

Carbery, Marcus, 08

Catano, Christopher, 0E

Chang, Shihsheng, 0P

Chen, Owen, 08

Chen, Ssuwei, 08

Cho, Yong-Tae, 08

Chopra, Meghali, 09, 0T

Collaert, N., 05

De Jaeger, B., 05

de Wit, Ruud, 08

Deckers, David, 08

Demand, Marc, 0P

Demuynck, Steven, 0P

Derville, A., 0C

Devriendt, K., 05

Ervin, J., 0Q

Foucher, J., 0C

Fried, David, 0H

Gey, G., 0C

Giannelis, Emmanuel P., 06

Helpert, Sofia, 09, 0T

Hisamatsu, Toru, 0B

Honda, Masanobu, 0B

Hopf, Toby, 05, 0P

Horiguchi, N., 05

Hsu, Chih-Yu, 0M

Jeong, Ik-Hyun, 08

Joy, Nicholas, 0E

Ju, Jae-Wuk, 08

Jung, Seok-Heon, 06

Katsunuma, Takayuki, 0B

Kenis, K., 05

Kihara, Yoshihide, 0B

Kim, Heung-Joo, 08

Kim, Hyun-Sok, 08

Kim, R. H., 0Q

Kim, Young-Sik, 08

Koo, Seung-Woo, 08

Kumar, Kaushik, 0P

Kwon, Heidi, 08

Lariviere, S., 0Q

Lee, Changwoo, 0G

Lee, Jae Gyoo, 08

Mannaert, G., 05

Martinez, S., 0C

Metz, Andrew, 0P

Milenin, A., 05

Musselman, Marcus, 08

Ober, Christopher K., 06

Oh, Nang-Lyeom, 08

Pan, Wenyang, 06

Pan, Yang, 0H

Peralagu, U., 05

Peter, A., 05

Radisic, Dunja, 0P

Ranjan, Alok, 04, 0E

Sakai, Kazunori, 06

Schmidt, Lucian, 08

Sebaai, Farid, 05, 0P

Shamma, Nader, 0H

Shen, Peng, 0M

Shinagawa, J., 04

Smith, Jeffrey, 0P

Sobieski, Daniel, 0H

Sridhar, Shyam, 0E

Stafford, Nathan, 0M

Sun, Junling, 0P

Talone, Christopher, 0E

Teugels, Lieve, 05, 0P

Vais, A., 05

van Dorp, D., 05

van Hemert, Tom, 08

Varadarajan, Bhadri, 07

Ventzek, P. L. G., 04

Viatkina, Katja, 08

Vincent, Benjamin, 0Q

Voronin, Sergey, 0E

Waldron, N., 05

Walke, A., 05

Wilson, C., 0Q

Wise, Rich, 0H

Witters, L., 05

Wostyn, K., 05

Yu, H., 05

Yu, Jengyi, 0H

Conference Committee

Symposium Chair

  • Will Conley, Cymer, an ASML Company (United States)

Symposium Co-Chair

  • Kafai Lai, IBM Thomas J. Watson Research Center (United States)

Conference Chair

  • Richard S. Wise, Lam Research Corporation (United States)

Conference Co-Chair

  • Catherine B. Labelle, Intel Corporation (United States)

Conference Program Committee

  • Efrain Altamirano-Sánchez, IMEC (Belgium)

  • Keun Hee Bai, SAMSUNG Electronics Company, Ltd. (Korea, Republic of)

  • Julie Bannister, Tokyo Electron America, Inc. (United States)

  • Maxime Darnon, LN2 CNRS (Canada)

  • Sebastian U. Engelmann, IBM Thomas J. Watson Research Center (United States)

  • Eric A. Hudson, Lam Research Corporation (United States)

  • Kaushik A. Kumar, Tokyo Electron Ltd. (Japan)

  • Qinghuang Lin, IBM Thomas J. Watson Research Center (United States)

  • Ru-Gun Liu, Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan)

  • Nihar Mohanty, Oculus VR, LLC (United States)

  • Jake O’Gorman, Hitachi High Technologies America, Inc. (United States)

  • Erwine Pargon, CNRS/LTM (France)

  • Nicolas Posseme, CEA-LETI (France)

  • Ricardo Ruiz, HGST (United States)

  • Yuyang Sun, Mentor Graphics Corporation (United States)

  • Ying Zhang, NAURA (United States)

Session Chairs

  • 1 Keynote Session: Plasma Based Patterning Innovations

    Efrain Altamirano-Sánchez, IMEC (Belgium)

    Richard S. Wise, Lam Research Corporation (United States)

  • 2 Materials and Etch Integration

    Eric A. Hudson, Lam Research Corporation (United States)

    Efrain Altamirano-Sánchez, IMEC (Belgium)

  • 3 Patterning Process Control and Computational Patterning

    Ricardo Ruiz, HGST, Inc. (United States)

    Yuyang Sun, Mentor, a Siemens Business (United States)

  • 4 Atomic Layer Etching and Novel Plasma Techniques

    Jake O’Gorman, Hitachi High Technologies America, Inc. (United States)

    Catherine Labelle, Intel Corporation (United States)

  • 5 EUV Patterning and Etch: Joint session with conferences 10957 and 10963

    Rich S. Wise, Lam Research Corporation (United States)

    Nelson Felix, IBM Thomas J. Watson Research Center (United States)

  • 6 Patterning Solutions for Emerging Applications

    Nihar Mohanty, Oculus VR, LLC (United States)

    Rich S. Wise, Lam Research Corporation (United States)

  • 7 Advanced Patterning Integration

    Julie Bannister, Tokyo Electron America, Inc. (United States)

    Nicolas Possémé, CEA-LETI (France)

  • 8 Patterning Solutions for Emerging Applications II

    Jake O’Gorman, Hitachi High Technologies America, Inc. (United States)

    Qinghuang Lin, ASML US, Inc. (United States)

© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
"Front Matter: 10963", Proc. SPIE 10963, Advanced Etch Technology for Nanopatterning VIII, 1096301 (14 June 2019); https://doi.org/10.1117/12.2533873
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KEYWORDS
Etching

Optical lithography

Plasma etching

Plasma

CMOS technology

Control systems

Current controlled current source

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