CONFERENCE PROCEEDINGS
Advanced Search
Home > Proceedings > Volume 10905 > Article
Presentation + Paper
4 March 2019 Laser-Induced Forward Transfer of silver-based pastes for metallization of photovoltaic devices
David Canteli, David Munoz-Martin, Miguel Morales, Sara Lauzurica, Juan José Moreno, Andrés Márquez, Miguel Gómez-Fontela, Carlos Molpeceres
Author Affiliations +
Proceedings Volume 10905, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIV; 109050M (2019) https://doi.org/10.1117/12.2508975
Event: SPIE LASE, 2019, San Francisco, California, United States
Abstract
Laser-induced forward transfer (LIFT) is a fast, clean, non-contact metallization technique that allows the deposition of small volumes (down to picoliters) of a wide range of materials in a very precise and controlled way. In this work, we show a complete description of the metallization by LIFT using pulsed laser sources and a commercial silver-based paste. We include a description of the transference process and discuss the influence of the paste viscosity and the acceptor substrate roughness. To avoid the use of a standard paste-curing process in a furnace, a second laser process is used to cure the silver paste in a selective way, preventing any thermal damage in the materials below the paste or in other parts of the device. In summary, we show that the use of a LIFT technique allows the metallization of wide areas with high aspect ratio lines, that can be cured selectively, and present very good mechanical properties, being suitable for its use in flexible electronics applications.
Conference Presentation
© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation Download Citation
David Canteli, David Munoz-Martin, Miguel Morales, Sara Lauzurica, Juan José Moreno, Andrés Márquez, Miguel Gómez-Fontela, and Carlos Molpeceres "Laser-Induced Forward Transfer of silver-based pastes for metallization of photovoltaic devices", Proc. SPIE 10905, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIV, 109050M (4 March 2019); https://doi.org/10.1117/12.2508975
ACCESS THE FULL ARTICLE
ORGANIZATIONAL
Sign in with credentials provided by your organization.
INSTITUTIONAL
Select your institution to access the SPIE Digital Library.
SELECT YOUR INSTITUTION
PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
PERSONAL SIGN IN
No SPIE Account? Create one
PURCHASE THIS CONTENT
SUBSCRIBE TO DIGITAL LIBRARY
50 downloads per 1-year subscription
Members: $195
Non-members: $335 ADD TO CART
25 downloads per 1 - year subscription
Members: $145
Non-members: $250 ADD TO CART
PURCHASE SINGLE ARTICLE
Includes PDF, HTML & Video, when available
Members: $17.00
Non-members: $21.00 ADD TO CART
PROCEEDINGS
 8 PAGES + PRESENTATION
DOWNLOAD PAPER SAVE TO MY LIBRARY
WATCH
PRESENTATION
GET CITATION
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Laser processing
Pulsed laser operation
Photovoltaics
Continuous wave operation
Laser applications
Printing
RELATED CONTENT
Subscribe to Digital Library
Receive Erratum Email Alert
Back to Top