Novel Chemical Amplification System in Azide/Phenolic Resin-Based Negative Resist

Emiko Aoki; Hiroshi Shiraishi; Michiaki Hashimoto; Nobuaki Hayashi

doi:10.1117/12.968541

1 August 1989 Novel Chemical Amplification System in Azide/Phenolic Resin-Based Negative Resist

Emiko Aoki, Hiroshi Shiraishi, Michiaki Hashimoto, Nobuaki Hayashi

Proceedings Volume 1089, Electron-Beam, X-Ray, and Ion-Beam Technology: Submicrometer Lithographies VIII; (1989) https://doi.org/10.1117/12.968541
Event: 1989 Santa Clara Symposium on Microlithography, 1989, San Jose, CA, United States

Abstract

A novel chemical amplification system based on an azide/phenolic resin-based negative resist is described. The new resist, which consists of an azide, a phenolic resin matrix, and a carboxylic acid, can be developed in aqueous alkaline solutions. Electron-beam exposure of this resist results in the production of a primary amine. In a subsequent post-exposure baking step, the primary amine catalyzes decarboxylation of the carboxylic acid. Additionally, the decarboxylation product acts as an aqueous alkaline dissolution inhibitor in the exposed areas. On the other hand, the carboxylic acid remaining in the unexposed areas promotes the dissolution rate of those areas. The new resist shows non-swelling pattern-formation by using the aqueous alkaline developer, and the sensitivity to electron beams is about three times higher than that of MRS.

Citation Download Citation

Emiko Aoki, Hiroshi Shiraishi, Michiaki Hashimoto, and Nobuaki Hayashi "Novel Chemical Amplification System in Azide/Phenolic Resin-Based Negative Resist", Proc. SPIE 1089, Electron-Beam, X-Ray, and Ion-Beam Technology: Submicrometer Lithographies VIII, (1 August 1989); https://doi.org/10.1117/12.968541

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