Paper
19 July 1989 Advanced Manufacturing Techniques As Applied To ASIC Photolithographic Processing
Daniel C. Carter, Brian P. Bystedt
Author Affiliations +
Abstract
An advanced manufacturing photolithographic process has been developed and implemented. Utilizing conventional processing techniques the process demonstrates high levels of consistency and uniformity while maintaining simplicity. The 1.5 micron process as monitored by electrical metrology techniques has demonstrated long term consistency of exposure latitude and critical dimension uniformity. All aspects of processing including coat, expose, develop and etch contribute to a total variation of less than 10% of nominal linewidth. Statistical process control combined with equipment matching has facilitated process standardization and allows for the elimination of all pilots and set-up wafers bringing high throughput ASIC manufacturing to a reality.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Daniel C. Carter and Brian P. Bystedt "Advanced Manufacturing Techniques As Applied To ASIC Photolithographic Processing", Proc. SPIE 1087, Integrated Circuit Metrology, Inspection, and Process Control III, (19 July 1989); https://doi.org/10.1117/12.953099
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KEYWORDS
Process control

Critical dimension metrology

Metrology

Etching

Manufacturing

Semiconducting wafers

Inspection

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