Novolak Based Thermally Resistant Positive Photoresist: Resin Design and Performance

A. Zampini; R. L. Fischer; J. B. Wickman

doi:10.1117/12.953021

30 January 1989 Novolak Based Thermally Resistant Positive Photoresist: Resin Design and Performance

A. Zampini, R. L. Fischer, J. B. Wickman

Proceedings Volume 1086, Advances in Resist Technology and Processing VI; (1989) https://doi.org/10.1117/12.953021
Event: 1989 Santa Clara Symposium on Microlithography, 1989, San Jose, CA, United States

Abstract

The role of resin structure, molecular weight and glass transition temperature, Tg, on the thermal performance of positive photoresists were investigated. The novolak resins in these resists have structures with progressively higher order of regularity, stiffness and intermolecular hydrogen bonding, yet of sufficient molecular weight to be functional. We have found good correlation between resist thermal performance and the novolak resin chemical composition and structure. Cresylic formaldehyde resins provide almost identical hardbake deformation temperature, HBDT, regardless of the resin Tg, structure, monomer ratio and resist solvent. Resistance to thermal flow increases as the resin stiffness, aromatic character and intermolecular hydrogen bonding are increased. Photoresist resolution, however, is dependent on the type of solvent used, resin molecular weight, chemical composition and structure. Photoresist compositions which exhibit the higher HBDT, generally, have poor resolution capability. By properly balancing the resin structure and composition, positive photoresists were developed showing high resolution capability and resistance to thermal flow, in the range of 145 to 190°C.

Citation Download Citation

A. Zampini, R. L. Fischer, and J. B. Wickman "Novolak Based Thermally Resistant Positive Photoresist: Resin Design and Performance", Proc. SPIE 1086, Advances in Resist Technology and Processing VI, (30 January 1989); https://doi.org/10.1117/12.953021

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