Trade-offs between stress control and blister avoidance in MEMS devices

Quansheng Sun; Lixiang Wu; Junli Wang; Gaofeng Wang

doi:10.1117/12.2506757

24 January 2019 Trade-offs between stress control and blister avoidance in MEMS devices

Quansheng Sun, Lixiang Wu, Junli Wang, Gaofeng Wang

Proceedings Volume 10840, 9th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Micro- and Nano-Optics, Catenary Optics, and Subwavelength Electromagnetics; 108400B (2019) https://doi.org/10.1117/12.2506757
Event: Ninth International Symposium on Advanced Optical Manufacturing and Testing Technologies (AOMATT2018), 2018, Chengdu, China

Abstract

Thin films such as silicon nitride (SiN_x) films, amorphous silicon (α-Si) films are fundamental in most microelectromechanical systems (MEMS). The thin-film stress is, in particular, of great importance for obtaining expected or controlled physical performance in MEMS devices. However, unexpected failures, especially blister defects, often occur when post-processing, for example, rapid thermal processing (RTP), is applied to the device. Through the preliminary experiment, we find that there is a trade-off between stress control and blister avoidance, and the roughness of the as-grown thin film is a good indicator to show the relationship between the thin-film stress and blister defects. Also, the experiment result shows that there is a balance between film stress and blister defects.

Citation Download Citation

Quansheng Sun, Lixiang Wu, Junli Wang, and Gaofeng Wang "Trade-offs between stress control and blister avoidance in MEMS devices", Proc. SPIE 10840, 9th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Micro- and Nano-Optics, Catenary Optics, and Subwavelength Electromagnetics, 108400B (24 January 2019); https://doi.org/10.1117/12.2506757

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