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16 January 2019 Combined technique of chemical mechanical polishing and acid etching for improving the laser-induced damage threshold of calcium fluoride
Zhifan Lin, Feng Shi, Yifan Dai, Xiaoqiang Peng, Hao Hu, Ci Song
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Proceedings Volume 10838, 9th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies; 108380T (2019) https://doi.org/10.1117/12.2505074
Event: Ninth International Symposium on Advanced Optical Manufacturing and Testing Technologies (AOMATT2018), 2018, Chengdu, China
Abstract
To further increase the laser-induced damage threshold (LIDT) of calcium fluoride (CaF2), combined technique of chemical mechanical polishing (CMP) and acid etching as a function of removal mechanical defect and impurity contamination was investigated. After CMP process, the surface roughness reduced to Ra 0.68nm, the scratch and subsurface defect were mitigated which rise the LIDT to 8.6 J/cm-2. Due to the acid etching, the surface roughness of CaF2 elements increased to Ra 0.8nm, while the LIDT reached 11 J/cm-2, benefit from the elimination of impurity contamination. The result laser-induced damage test shows that, comparing to mechanical abrasive polishing (MAP), the LIDT increased by 240% after combined technique, it demonstrated that combined technique is an effective way to improve the resistance of laser damage of CaF2.
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Zhifan Lin, Feng Shi, Yifan Dai, Xiaoqiang Peng, Hao Hu, and Ci Song "Combined technique of chemical mechanical polishing and acid etching for improving the laser-induced damage threshold of calcium fluoride", Proc. SPIE 10838, 9th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 108380T (16 January 2019); https://doi.org/10.1117/12.2505074
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KEYWORDS
Chemical mechanical planarization
Laser induced damage
Surface finishing
Etching
Laser damage threshold
Polishing
Surface roughness
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