Abstract
This PDF file contains the front matter associated with SPIE Proceedings Volume 10807, including the Title Page, Copyright information, Table of Contents, and Conference Committee listing.

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Author(s), “Title of Paper,” in Photomask Japan 2018: XXV Symposium on Photomask and Next-Generation Lithography Mask Technology, edited by Kiwamu Takehisa, Proceedings of SPIE Vol. 10807 (SPIE, Bellingham, WA, 2018) Seven-digit Article CID Number.

ISSN: 0277-786X

ISSN: 1996-756X (electronic)

ISBN: 9781510622012

ISBN: 9781510622029 (electronic)

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Paper Numbering: Proceedings of SPIE follow an e-First publication model. A unique citation identifier (CID) number is assigned to each article at the time of publication. Utilization of CIDs allows articles to be fully citable as soon as they are published online, and connects the same identifier to all online and print versions of the publication. SPIE uses a seven-digit CID article numbering system structured as follows:

  • The first five digits correspond to the SPIE volume number.

  • The last two digits indicate publication order within the volume using a Base 36 numbering system employing both numerals and letters. These two-number sets start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B … 0Z, followed by 10-1Z, 20-2Z, etc. The CID Number appears on each page of the manuscript.

Authors

Numbers in the index correspond to the last two digits of the seven-digit citation identifier (CID) article numbering system used in Proceedings of SPIE. The first five digits reflect the volume number. Base 36 numbering is employed for the last two digits and indicates the order of articles within the volume. Numbers start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B…0Z, followed by 10-1Z, 20-2Z, etc.

Abe, Tsukasa, 0F

Arai, Tsuyoshi, 02, 04

Asada, Hironori, 0O

Azuma, Hisanobu, 04

Azumano, Hidehito, 08

Badger, Karen, 0D

Beyer, Dirk, 0K

Birnstein, Anka, 0D

Biyajima, Tsuneaki, 0I

Chang, I-Y., 0L

D’havé, Koen, 0K

Deng, Erwin, 0L

Fang, Xiang, 0L

Figueiro, Thiago, 0A

Fujimura, Aki, 0C

Fukugami, Norihito, 0N

Han, Runyuan, 0M

Harada, Daijitsu, 05

Hattori, Kei, 08

Hayashi, Naoya, 0F

Heumann, Jan, 0D

Hoshino, Ryoichi, 0O

Hsu, Yuan, 0J

Huang, Elven, 0L

Iino, Yoshinori, 08

Inoue, Hideo, 07

Inoue, Koji, 0B

Ishikawa, Hisako, 0I

Ishitsuka, Youkou, 05

Isogawa, Takeshi, 0D

Ita, Hirotsugu, 08

Iwakuma, Minako, 0O

Iwami, Mumenori, 08

Jonckheere, Rik, 0H

Kamo, Takashi, 0F, 0H

Karyu, Makoto, 08

Kawashima, Keisuke, 0B

Kishimura, Yukiko, 0O

Kobayashi, Shuhei, 06

Kodama, Shunpei, 08

Kodera, Yutaka, 0D, 0N

Kohmura, Kazuo, 0B, 0I

Komizo, Toru, 0N

Kon, Yasuo, 0A

Konishi, Toshio, 0D, 0N

Kono, Kenji, 0A

Krome, Thorsten, 0E

Laske, Frank, 0M

LeClaire, Jeff, 09

Lee, Chuan-Chun, 0L

Liao, Hung-Yueh, 0L

Lin, Chien-Nan, 0L

Lin, Ling-Chieh, 0L

Liu, Hsu-Tang, 0L

Lu, Min-Ying, 0L

Ma, Shou-Yuan, 0L

Martin, Luc, 0A

Masui, Kenji, 0F

Matsumoto, Hiroshi, 07

Matsuoka, Yoichi, 04

Miyamoto, Takashi, 08

Miyoshi, Masayuki, 06

Morikawa, Yasutaka, 0F, 0H

Morishita, Keiko, 0F

Mouraille, Orion, 0K

Muirhead, Jonathan, 0L

Murasato, Naoki, 02

Muto, Makoto, 08

Nakazawa, Kazuki, 08

Nesládek, Pavel, 0E

Ochiai, Shunsuke, 0O

Oda, Takashi, 0B

Ohtoshi, Kenji, 07

Okamoto, Yoshie, 08

Okubo, Atsushi, 0I

Ono, Yosuke, 0I

Otten, Ronald, 0K

Petroni, Paolo, 0A

Postnikov, Sergei, 0A

Robinson, Tod, 09

Roeth, Klaus-Dieter, 0M

Satou, Yutaka, 0J

Schiavone, Patrick, 0A

Seki, Kazunori, 0D

Shen, Ming-Feng, 0L

Shirahama, Hiroki, 08

Steigerwald, Hendrik, 0M

Steinert, Steffen, 0K

Takai, Kosuke, 0F

Takeuchi, Masaki, 05

Tamaru, Kenta, 0O

Tamura, Takao, 07

Taneichi, Daiki, 0I

Terakado, Hideaki, 08

Tsukino, Yasunari, 0A

van Dijk, Leon, 0K

van Haren, Richard, 0K

Watabe, Atsushi, 05

Watanabe, Genta, 0N

Willis, Jan, 0C

Yamane, Takeshi, 0H

Yamashita, Hiroshi, 07

Yang, Chuen-Huei, 0L

Yonetani, Masashi, 0D

Yoshida, Koichiro, 06

Yoshikawa, Yutaka, 06

Yoshimori, Tomoaki, 08

Conference Committee

Symposium Chair

  • Masato Shibuya, Tokyo Polytechnic University (Japan)

Symposium Vice Chair

  • Takeo Watanabe, University of Hyogo (Japan)

Advisory Committee Chair

  • Tadahiro Takigawa, ALITECS Corporation (Japan)

Advisory Committee

  • Naoya Hayashi, Dai Nippon Printing Company, Ltd. (Japan)

  • Morihisa Hoga, Consultant (Japan)

  • Toshiyuki Horiuchi, Tokyo Denki University (Japan)

  • Masanori Komuro, Consultant (Japan)

  • Masao Otaki, Consultant (Japan)

  • Yoshio Tanaka, D2S, Inc. (USA) and D2S K.K. (Japan)

Organizing Committee Chair

  • Masato Shibuya, Tokyo Polytechnic University (Japan)

Organizing Committee Vice Chair

  • Takeo Watanabe, University of Hyogo (Japan)

Organizing Committee

  • Uwe Behringer, UBC Microelectronics (Germany)

  • Junko Collins, SEMI Japan (Japan)

  • Brian J. Grenon, RAVE, LLC (USA)

  • Hideaki Hamada, HTL Company Japan Ltd. (Japan)

  • Eiichi Hoshino, Nikon Corporation (Japan)

  • Toshio Konishi, Toppan Printing Company, Ltd. (Japan)

  • Koji Mikami, Canon Inc. (Japan)

  • Hideaki Mitsui, HOYA Corporation (Japan)

  • Hiroyuki Miyashita, Dai Nippon Printing Company, Ltd. (Japan)

  • Junji Miyazaki, ASML Japan Company, Ltd. (Japan)

  • Warren Montgomery, Irresistible Materials (USA)

  • Hiroaki Morimoto, Toppan Printing Company, Ltd. (Japan)

  • Kiwamu Takehisa, Lasertec Corporation (Japan)

  • Anto Yasaka, Hitachi High-Tech Science Corporation (Japan)

Auditors

  • Ichiro Kagami, Sony Semiconductor Manufacturing Corporation (Japan)

  • Yoji Tonooka, Toppan Printing Company, Ltd. (Japan)

Steering Committee Chair

  • Toshio Konishi, Toppan Printing Company, Ltd. (Japan)

Steering Committee Vice Chairs

  • Takashi Kamo, Toshiba Memory Corporation (Japan)

  • Kazuyuki Sukou, Dai Nippon Printing Company, Ltd. (Japan)

Steering Committee

  • Akihiko Ando, Toshiba Memory Corporation (Japan)

  • Junji Hirumi, Mie FUJITSU Semiconductor Ltd. (Japan)

    Kunihiro Hosono, Renesas System Design Company, Ltd. (Japan)

  • Kokoro Kato, Nihon Synopsys G.K. (Japan)

  • Yutaka Kodera, Toppan Printing Company, Ltd. (Japan)

  • Yasutaka Morikawa, Dai Nippon Printing Company, Ltd. (Japan)

  • Naoki Nishida, HOYA Corporation (Japan)

  • Teruaki Noguchi, JEOL Ltd. (Japan)

  • Kiwamu Takehisa, Lasertec Corporation (Japan)

  • Nobuyuki Yoshioka, Dai Nippon Printing Company, Ltd. (Japan)

  • Shusuke Yoshitake, NuFlare Technology, Inc. (Japan)

Program Committee Chair

  • Kiwamu Takehisa, Lasertec Corporation (Japan)

Program Committee Vice Chairs

  • Akihiko Ando, Toshiba Memory Corporation (Japan)

  • Yutaka Kodera, Toppan Printing Company, Ltd. (Japan)

Program Committee

  • Tsukasa Abe, Dai Nippon Printing Company, Ltd. (Japan)

  • Hajime Aoyama, Nikon Corporation (Japan)

  • Peter Buck, Mentor Graphics Corporation (USA)

  • Thomas Faure, GLOBALFOUNDRIES Corporation (USA)

  • Kazuyuki Hagiwara, D2S K.K. (Japan)

  • Terumasa Hirano, HOYA Corporation (Japan)

  • Hidemichi Imai, Dai Nippon Printing Company, Ltd. (Japan)

  • Franklin Kalk, Toppan Photomasks. Inc. (USA)

  • Takashi Kamikubo, NuFlare Technology, Inc. (Japan)

  • Izak Kapilevich, Applied Materials, Inc. (USA)

  • Bryan Kasprowicz, Photronics (USA)

  • Kokoro Kato, Nihon Synopsys G.K. (Japan)

  • Yusuke Kawano, Renesas Electronics Corporation (Japan)

  • Byung-Gook Kim, Samsung Electronics Company, Ltd. (Korea)

  • Masaaki Koyama, Sony Semiconductor Manufacturing Corporation (Japan)

  • Yasuyuki Kushida, Mie FUJITSU Semiconductor Ltd. (Japan)

  • John Lin, Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan)

  • Hironobu Manabe, JEOL Ltd. (Japan)

  • Junji Miyazaki, ASML Japan Company, Ltd. (Japan)

  • Yoshinori Nagaoka, KLA-Tencor Japan Ltd. (Japan)

  • Chiaki Sato, Canon Inc. (Japan)

  • Patrick Schiavone, ASELTA Nanographics (France)

  • Kazunori Seki, Toppan Printing Company, Ltd. (Japan)

  • Tsutomu Shoki, HOYA Corporation (Japan)

  • Yasunari Sohda, Hitachi, Ltd. (Japan)

  • Yasuko Tabata, TowerJazz Panasonic Semiconductor Company, Ltd. (Japan)

  • Nobuhiko Yabu, Canon Inc. (Japan)

  • Shingo Yoshikawa, Dai Nippon Printing Company, Ltd. (Japan)

  • Guojing Zhang, Intel Corporation (USA)

Session Chairs

  • 1 NIL

    Akihiko Ando, Toshiba Memory Corporation (Japan)

    Douglas Resnick, Canon Nanotechnologies, Inc. (USA)

  • 2 FPD Photomasks

    Nobuhiko Yabu, Canon Inc. (Japan)

    Hajime Aoyama, Nikon Corporation (Japan)

  • 3 Wring & Metrology

    Takashi Kamikubo, NuFlare Technology, Inc. (Japan)

    Uwe Behringer, UBC Microelectronics (Germany)

  • 4 Process & Repair

    Yasutaka Morikawa, Dai Nippon Printing Company, Ltd. (Japan)

  • 5 EDA & Lithography

    Yoshinori Nagaoka, KLA-Tencor Japan Ltd. (Japan)

    Bala Thumma, Synopsys, Inc. (USA)

  • 6 EUV Masks (I)

    Tsutomu Shoki, HOYA Corporation (Japan)

    Jim Wiley, ASML (The Netherlands)

  • 7 EUV Source for Inspection

    Junji Miyazaki, ASML Japan (Japan)

    Pavel Nesladek, Advanced Mask Technology Center GmbH & Company KG (Germany)

  • 8 25th Anniversary Special Session

    Kiwamu Takehisa, Lasertec Corporation (Japan)

    Kokoro Kato, Nihon Synopsys G.K. (Japan)

  • 10 EUV Masks (II)

    Yutaka Kodera, Toppan Printing Company, Ltd. (Japan)

    Izak Kapilevich, Applied Materials, Inc. (USA)

  • 11 EUV Masks (III)

    Tsukasa Abe, Dai Nippon Printing Company, Ltd. (Japan)

    Rik Jonckheere, Imec (Belgium)

  • 12 EUV Masks (IV)

    Kazunori Seki, Toppan Printing Company, Ltd. (Japan)

    Jim Wiley, ASML (The Netherlands)

© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
"Front Matter: Volume 10807", Proc. SPIE 10807, Photomask Japan 2018: XXV Symposium on Photomask and Next-Generation Lithography Mask Technology, 1080701 (20 July 2018); https://doi.org/10.1117/12.2504156
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