The Euclid STM VIS focal plane assembly: from the integration to the qualification tests (Conference Presentation)

Jérôme Martignac; Benoît Horeau; François Visticot; Michael Carty; Jean Fontignie; Jean-Yves Roussé; Thierry Tourrette; Thierry Orduna; Damien Bachet; Michel Berthé; Jérôme Amiaux; Philippe Ferrando; Luc Dumaye; Duc-Dat Huynh; Diana Renaud; Vincent Hennion; Pascal Contrepois; Patrice Charon; Arnaud Roger; Jean-Michel Joubert; Dominique Gibier; Nicolas Solenne; Mark Cropper; Sabrina Pottinger; Magdalena Szafraniec; Ruyman Azzollini; Saeeda Awan; Thomas Hunt; Ashraf Al-Bahlawan; Cédric Thizy; Sylvie Liebecq; Valérie Samain; Pascale Danto

doi:10.1117/12.2312579

10 July 2018 The Euclid STM VIS focal plane assembly: from the integration to the qualification tests (Conference Presentation)

Jérôme Martignac, Benoît Horeau, François Visticot, Michael Carty, Jean Fontignie, Jean-Yves Roussé, Thierry Tourrette, Thierry Orduna, Damien Bachet, Michel Berthé, Jérôme Amiaux, Philippe Ferrando, Luc Dumaye, Duc-Dat Huynh, Diana Renaud, Vincent Hennion, Pascal Contrepois, Patrice Charon, Arnaud Roger, Jean-Michel Joubert, Dominique Gibier, Nicolas Solenne, Mark Cropper, Sabrina Pottinger, Magdalena Szafraniec, Ruyman Azzollini, Saeeda Awan, Thomas Hunt, Ashraf Al-Bahlawan, Cédric Thizy, Sylvie Liebecq, Valérie Samain, Pascale Danto

Author Affiliations +

Proceedings Volume 10698, Space Telescopes and Instrumentation 2018: Optical, Infrared, and Millimeter Wave; 1069829 (2018) https://doi.org/10.1117/12.2312579
Event: SPIE Astronomical Telescopes + Instrumentation, 2018, Austin, Texas, United States

Abstract

In the frame work of the ESA Euclid mission to be launched in 2020, the Euclid Consortium is developing an extremely large and stable focal plane for the VIS instrument. After an extensive phase of definition and study over 4 years made at CEA on the thermo-mechanical architecture of that Focal Plane, the first model (Structural and Thermal Model) has been assembled qualified and delivered to MSSL in June 2017. The VIS Focal Plane Assembly integrates 36 CCDs (operated at 150K) connected to their front end electronics (operated at 280K). This Focal Plane will be the largest focal plane (~0.6 billion pixels) ever built for space application after the GAIA one. The CCDs are CCD273 type specially designed and provided by the Teledyne e2v company under ESA contract, front end electronics is studied and provided by MSSL. The Structural and Thermal Model is fully representative of the Flight Model regarding the thermo-mechanical architecture. As the instrument development philosophy follows a Proto Flight approach this choice has been made very early in the development program in order to reduce the risk on the PFM program. So the AIT/AIV plan has been built in order to fully validate since the STM program the overall integration, verification and qualification sequences, taking into account the very stringent cleanliness requirement. The STM FPA integrates 36 CCDs representative of the flight model except for the detection function. Electrical configuration of the front end electronics provides electrical interface in order to power the CCDs and check integrity of all the electrical links to CCDs. In this paper we first recall the architecture of the VIS-FPA and especially the solutions proposed to cope with the scientific needs of an extremely stable focal plane, both mechanically and thermally leading to a SiC structure. The modular architecture concept, considered as a key driver for such big and complex focal plane is detailed. Parallel to that, the integration workflow including verification steps is fully depicted including specific aspects linked to the use of SiC. Validation and qualification test program is described. A summary of geometrical measurements, thermal balance tests and vibrations tests including the main Ground Support Equipment description are reported. Keyword list: Euclid, CCD, SiC, focal plane, architecture, integration

Conference Presentation

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Jérôme Martignac, Benoît Horeau, François Visticot, Michael Carty, Jean Fontignie, Jean-Yves Roussé, Thierry Tourrette, Thierry Orduna, Damien Bachet, Michel Berthé, Jérôme Amiaux, Philippe Ferrando, Luc Dumaye, Duc-Dat Huynh, Diana Renaud, Vincent Hennion, Pascal Contrepois, Patrice Charon, Arnaud Roger, Jean-Michel Joubert, Dominique Gibier, Nicolas Solenne, Mark Cropper, Sabrina Pottinger, Magdalena Szafraniec, Ruyman Azzollini, Saeeda Awan, Thomas Hunt, Ashraf Al-Bahlawan, Cédric Thizy, Sylvie Liebecq, Valérie Samain, and Pascale Danto "The Euclid STM VIS focal plane assembly: from the integration to the qualification tests (Conference Presentation)", Proc. SPIE 10698, Space Telescopes and Instrumentation 2018: Optical, Infrared, and Millimeter Wave, 1069829 (10 July 2018); https://doi.org/10.1117/12.2312579

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KEYWORDS

Charge-coupled devices

Scanning tunneling microscopy

Thermal modeling

Electronics

Silicon carbide

Integration

Interfaces

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