Performance validation of Mapper's FLX-1200

Marco Wieland; Guido de Boer; Pieter Brandt; Michel Dansberg; Remco Jager; Jerry Peijster; Erwin Slot; Stijn Steenbrink; Yoann Blancquaert; Stefan Landis; Laurent Pain; Jonathan Pradelles; Guido Rademaker; Isabelle Servin

doi:10.1117/12.2300816

19 March 2018 Performance validation of Mapper's FLX-1200

Marco Wieland, Guido de Boer, Pieter Brandt, Michel Dansberg, Remco Jager, Jerry Peijster, Erwin Slot, Stijn Steenbrink, Yoann Blancquaert, Stefan Landis, Laurent Pain, Jonathan Pradelles, Guido Rademaker, Isabelle Servin

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Proceedings Volume 10584, Novel Patterning Technologies 2018; 105840G (2018) https://doi.org/10.1117/12.2300816
Event: SPIE Advanced Lithography, 2018, San Jose, California, United States

Abstract

Mapper has installed its first product, the FLX–1200, at CEA-Leti in Grenoble (France). This is a maskless lithography system, based on massively parallel electron-beam writing with high-speed optical data transport for switching the electron beams. The FLX-1200, containing 65,000 parallel electron beams in a 13mm x 2mm electron optics slit, is capable of patterning any resolution and any different type of structure all the way down to 28 nm node patterns. As of August 2017 the FLX-1200 has a fully operational electron optics column, including a 65,000 beam blanker. In this paper the latest technical achievements of the FLX-1200 have been described: beam current is at 80% of FLX-1300 target (85 minutes per wafer). For 42nm hp dense lines a CDu of 8nm 3σ and a LWR of 5nm 3σ has been demonstrated. The stitching error is 12nm μ+3σ and regarding overlay a 15nm capability demonstrated, provided matching strategy is implemented and the mirror map is calibrated.

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Marco Wieland, Guido de Boer, Pieter Brandt, Michel Dansberg, Remco Jager, Jerry Peijster, Erwin Slot, Stijn Steenbrink, Yoann Blancquaert, Stefan Landis, Laurent Pain, Jonathan Pradelles, Guido Rademaker, and Isabelle Servin "Performance validation of Mapper's FLX-1200", Proc. SPIE 10584, Novel Patterning Technologies 2018, 105840G (19 March 2018); https://doi.org/10.1117/12.2300816

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