Here, we present the selective laser melting of pure copper using ultrashort laser pulses. This work involves a comparative study using 500 fs pulses at processing wavelengths of 515 nm and 1030 nm. The repetition rate of the applied laser system was varied within the MHz range in order to exploit heat accumulation. By using the ultrashort interaction times and tailoring the repetition rate, the induced melt pool can be significantly optimized yielding robust copper parts revealing thin-wall structures in the range below 100 μm. |
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CITATIONS
Cited by 4 scholarly publications.
Copper
Ultrafast phenomena
Additive manufacturing
Image processing
Spatial light modulators
Pulsed laser operation
Thermal effects