Modular platform for optics assembly: high-precision dispensing (Conference Presentation)

Sebastian Haag; Tobias Müller; Andreas Beleke

doi:10.1117/12.2291049

14 March 2018 Modular platform for optics assembly: high-precision dispensing (Conference Presentation)

Sebastian Haag, Tobias Müller, Andreas Beleke

Proceedings Volume 10513, Components and Packaging for Laser Systems IV; 105130D (2018) https://doi.org/10.1117/12.2291049
Event: SPIE LASE, 2018, San Francisco, California, United States

Abstract

Mastering the process of dispensing is one of the key enablers for high-precision optics assembly. Industrial dispensing mainly needs to solve the problems of droplet volume control as well as droplet positioning. Both aspects are of high importance in order to achieve a highly repeatable assembly processes. For that purpose, AIXEMTEC has developed a machine-integrated calibration module. AIXEMTEC is provider of a modular platform for automated optics assembly consisting of integration platforms, tools for manipulation, dispensing and machine vision as well as modules for tray handling, special-purpose metrology and others. After a brief overview of the jet-dispensing technology and the dispensing tool used within the machine, this paper introduces a calibration module for contact-less dispensing systems. The calibration module implements an image-based approach synchronizing image acquisition with droplet release. This calibration module allows for machine-integrated closed loop calibration of the volume in sub-nanoliter-range as well as the horizontal position of droplets. Both control variables have been benchmarked and results will be presented in the paper. The calibration process will be outlined. The paper closes with the description of a typical application that benefit from machine-integrated droplet calibration.

Conference Presentation

Citation Download Citation

Sebastian Haag, Tobias Müller, and Andreas Beleke "Modular platform for optics assembly: high-precision dispensing (Conference Presentation)", Proc. SPIE 10513, Components and Packaging for Laser Systems IV, 105130D (14 March 2018); https://doi.org/10.1117/12.2291049

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