Optimize of shrink process with X-Y CD bias on hole pattern

Kyohei Koike; Arisa Hara; Sakurako Natori; Shohei Yamauchi; Masatoshi Yamato; Kenichi Oyama; Hidetami Yaegashi

doi:10.1117/12.2258221

27 March 2017 Optimize of shrink process with X-Y CD bias on hole pattern

Kyohei Koike, Arisa Hara, Sakurako Natori, Shohei Yamauchi, Masatoshi Yamato, Kenichi Oyama, Hidetami Yaegashi

Proceedings Volume 10146, Advances in Patterning Materials and Processes XXXIV; 101461N (2017) https://doi.org/10.1117/12.2258221
Event: SPIE Advanced Lithography, 2017, San Jose, California, United States

Abstract

Gridded design rules^[1] is major process in configuring logic circuit used 193-immersion lithography. In the scaling of grid patterning, we can make 10nm order line and space pattern by using multiple patterning techniques such as self-aligned multiple patterning (SAMP) and litho-etch- litho-etch (LELE)^[2][3][4]. On the other hand, Line cut process has some error parameters such as pattern defect, placement error, roughness and X-Y CD bias with the decreasing scale. We tried to cure hole pattern roughness to use additional process such as Line smoothing^[5] . Each smoothing process showed different effect. As the result, CDx shrink amount is smaller than CDy without one additional process. In this paper, we will report the pattern controllability comparison of EUV and 193-immersion. And we will discuss optimum method about CD bias on hole pattern.

Citation Download Citation

Kyohei Koike, Arisa Hara, Sakurako Natori, Shohei Yamauchi, Masatoshi Yamato, Kenichi Oyama, and Hidetami Yaegashi "Optimize of shrink process with X-Y CD bias on hole pattern", Proc. SPIE 10146, Advances in Patterning Materials and Processes XXXIV, 101461N (27 March 2017); https://doi.org/10.1117/12.2258221

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