The Infrared Automatic Mass Screening (IRAMS) System For Printed Circuit Board Fault Detection

Perry W. Hugo

doi:10.1117/12.940504

11 May 1987 The Infrared Automatic Mass Screening (IRAMS) System For Printed Circuit Board Fault Detection

Perry W. Hugo

Proceedings Volume 0780, Thermosense IX: Thermal Infrared Sensing for Diagnostics and Control; (1987) https://doi.org/10.1117/12.940504
Event: 1987 Technical Symposium Southeast on Optics, Electro-Optics, and Sensors, 1987, Orlando, FL, United States

Abstract

Office of the Program Manager for TMDE (OPM TMDE) has initiated a program to develop techniques for evaluating the performance of printed circuit boards (PCB's) using infrared thermal imaging. It is OPM TMDE's expectation that the standard thermal profile (STP) will become the basis for the future rapid automatic detection and isolation of gross failure mechanisms on units under test (UUT's). To accomplish this OPM TMDE has purchased two Infrared Automatic Mass Screening ( I RAMS) systems which are scheduled for delivery in 1987. The IRAMS system combines a high resolution infrared thermal imager with a test bench and diagnostic computer hardware and software. Its purpose is to rapidly and automatically compare the thermal profiles of a UUT with the STP of that unit, recalled from memory, in order to detect thermally responsive failure mechanisms in PCB's. This paper will review the IRAMS performance requirements, outline the plan for implementing the two systems and report on progress to date.

Citation Download Citation

Perry W. Hugo "The Infrared Automatic Mass Screening (IRAMS) System For Printed Circuit Board Fault Detection", Proc. SPIE 0780, Thermosense IX: Thermal Infrared Sensing for Diagnostics and Control, (11 May 1987); https://doi.org/10.1117/12.940504

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