New Positive Resist Designed For Use In The Mid Ultraviolet

R. F. Leonard; W. F. Cordes III

doi:10.1117/12.935130

7 November 1983 New Positive Resist Designed For Use In The Mid Ultraviolet

R. F. Leonard, W. F. Cordes III

Proceedings Volume 0394, Optical Microlithography II: Technology for the 1980s; (1983) https://doi.org/10.1117/12.935130
Event: 1983 Microlithography Conferences, 1983, Santa Clara, United States

Abstract

Waycoat WX-159 is a positive resist designed for use with optical aligners operating in the mid-UV (280-320 nm). Spectral data is presented indicating potential applications of WX-159 resist in the deep UV (220-280 nm) and near UV (330-400 nm) as well. Data are presented demonstrating the use of WX-159 in conventional UV as well as the mid-UV regime. The resist with both metal containing and metal ion free developers is characterized by two techniques: 1) contrast curve of remaining film thickness after development versus exposure energy, and 2) dissolution rate monitor comparison of exposed and unexposed WX-159 films. The impact of developer composition on resist profile is shown wherein WX-402 developer produces near vertical, flat topped, micron size WX-159 images.

Citation Download Citation

R. F. Leonard and W. F. Cordes III "New Positive Resist Designed For Use In The Mid Ultraviolet", Proc. SPIE 0394, Optical Microlithography II: Technology for the 1980s, (7 November 1983); https://doi.org/10.1117/12.935130

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