Monitoring Wafer Stepper Performance With Electrical Test Structures

M. A. Mitchell; V. Nagaswami

doi:10.1117/12.933683

15 October 1982 Monitoring Wafer Stepper Performance With Electrical Test Structures

M. A. Mitchell, V. Nagaswami

Proceedings Volume 0342, Integrated Circuit Metrology I; (1982) https://doi.org/10.1117/12.933683
Event: 1982 Technical Symposium East, 1982, Arlington, United States

Abstract

Metal crossbridge electrical test structures have been used to characterize linewidth non-uniformities caused by lithographic systems and processing. Artifacts can complicate the interpretation of electrical linewidth results. Self-heating in crossbridges is an artifact which can cause errors of more than 15%. Self-heating increases as the linewidth decreases. A procedure for eliminating self-heating effects is discussed.

Citation Download Citation

M. A. Mitchell and V. Nagaswami "Monitoring Wafer Stepper Performance With Electrical Test Structures", Proc. SPIE 0342, Integrated Circuit Metrology I, (15 October 1982); https://doi.org/10.1117/12.933683

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