Paper
15 October 1982 Inspection In The Third Dimension: Metal Mask Inspection Problems
Joseph E. Levine, Donald A. MacKinnon
Author Affiliations +
Proceedings Volume 0342, Integrated Circuit Metrology I; (1982) https://doi.org/10.1117/12.933678
Event: 1982 Technical Symposium East, 1982, Arlington, United States
Abstract
The thermal conduction module (TCM) used in the IBM 3081 processor series incorporates a 90mm square multilayer ceramic substrate which requires thin metal masks for thick film personalization. The LSI semiconductors used on the TCM's require similar masks. These masks require accurately located features and precise cavity geometries and surface characteristics. The type of mask encountered in manufacturing is described, and the current inspection, measurement, and data handling techniques are discussed. The need for an improved inspection system is highlighted.
© (1982) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Joseph E. Levine and Donald A. MacKinnon "Inspection In The Third Dimension: Metal Mask Inspection Problems", Proc. SPIE 0342, Integrated Circuit Metrology I, (15 October 1982); https://doi.org/10.1117/12.933678
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KEYWORDS
Photomasks

Inspection

Metals

Optical inspection

Ceramics

Semiconductors

Glasses

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