Laser nano-fabrication buried deep inside silicon wafers

Onur Tokel

doi:10.1117/12.2607911

1 April 2022 Laser nano-fabrication buried deep inside silicon wafers

Onur Tokel

Proceedings Volume PC11988, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVII; PC1198805 (2022) https://doi.org/10.1117/12.2607911
Event: SPIE LASE, 2022, San Francisco, California, United States

Abstract

Here, we demonstrate the first controlled nano-fabrication capability deep inside silicon wafers. We exploit a spatially-structured laser beam and novel fabrication approaches, in order to achieve multi-dimensional nano-confinement inside the bulk. We demonstrate the formation of 100-nm-sized buried structures. We further showcase this new capability with the first fully buried nano-photonic element inside silicon, a Bragg grating. To the best of our knowledge this constitutes the first controlled nano-fabrication capability, as well as the first functional nano-photonic device, created deep inside silicon without any surface alteration.

Conference Presentation

Citation Download Citation

Onur Tokel "Laser nano-fabrication buried deep inside silicon wafers", Proc. SPIE PC11988, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVII, PC1198805 (1 April 2022); https://doi.org/10.1117/12.2607911

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