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1 April 2022 Multi-surface wafer-level optics for adaption of diode laser waveguide modes into application modes
Dirk Hauschild
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Proceedings Volume PC11982, Components and Packaging for Laser Systems VIII; PC1198206 (2022) https://doi.org/10.1117/12.2609959
Event: SPIE LASE, 2022, San Francisco, California, United States
Abstract
To make use of all advantages of diode laser sources in industry, telecom and consumer applications the characteristics of the emitters have to be transformed into the beam shape or mode distribution that give the best compatibility with the individual applications in compact, integrated devices and packages. The use of multi-functional optics with several optical elements in one building block gives maximum functionality per device. The use of anamorphic mode-matching optical components produced on wafer level made of glass or silicon is a new solution that can match optical and economic challenges with only micro-optical element.
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Dirk Hauschild "Multi-surface wafer-level optics for adaption of diode laser waveguide modes into application modes", Proc. SPIE PC11982, Components and Packaging for Laser Systems VIII, PC1198206 (1 April 2022); https://doi.org/10.1117/12.2609959
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KEYWORDS
Semiconductor lasers
Waveguide modes
Optical components
Wafer-level optics
Beam shaping
Semiconducting wafers
Optical design
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